The 23rd International Conference on Electronic Packaging Technology-ICEPT2022
Release time:
2022-08-12
From August 9 to 11, 2022, the 23rd International Conference on Electronic Packaging Technology-ICEPT2022 was held in Jinshitan. As an important conference leading the global electronic packaging technology, the conference invited scholars and research institutions from many top universities such as Dalian University of Technology, Tsinghua University, Harbin Institute of Technology, Wuhan University, etc., as well as major semiconductor industry manufacturers and related sub-sectors such as packaging and etching. Related manufacturers were present to discuss. The special report covers research, technology and application solutions at the forefront of advanced packaging, including advanced packaging, packaging materials and processes, packaging design/modeling and simulation, interconnection technology, packaging manufacturing technology, quality and reliability, power electronics, optoelectronic devices and displays, microelectromechanical/sensors and IoT, packaging in emerging fields, etc. As a well-known enterprise in the industrialization of advanced electronic materials, Colid Company is also lucky to be invited to attend the meeting.
From August 9 to 11, 2022, the 23rd International Conference on Electronic Packaging Technology-ICEPT2022 was solemnly held in Jinshitan.As an important conference leading the global electronic packaging technology, the conference invited scholars and research institutions from many top universities such as Dalian University of Technology, Tsinghua University, Harbin Institute of Technology, Wuhan University, etc., as well as major semiconductor industry manufacturers and related sub-sectors such as packaging and etching. Related manufacturers were present to discuss.Thematic ReportCovers research, technology and application solutions at the forefront of advanced packaging, including advanced packaging, packaging materials and processes, and package design./Modeling and simulation, interconnection technology, packaging and manufacturing technology, quality and reliability, power electronics, optoelectronic devices and displays, microelectromechanical/sensors and IoT, emerging field packaging, etc,ColeidCompanyAs a well-known enterprise in the industrialization of advanced electronic materials, it is also fortunate to be invited to participate in the exchange.
ColeidCompanySince its inception has been adhering toWith the business philosophy of "excellent quality, reasonable price and adequate service", as a national high-tech enterprise specializing in the R & D and industrialization of high-purity electronic gases and semiconductor precursors, after years of development, it has become the leading enterprise of high-purity electronic gases and semiconductor precursors in China. Colid made an exhibition board at the conference site to show the company and products, and communicated with the on-site manufacturers on the intersection of business level, it answered some questions raised by exhibitors and received extensive attention from on-site manufacturers and participants. Collide is starting to build a new research and development center, and will continue to develop in independent research and development and collaborative innovation of industry, university and research, and increase research and development efforts for key technologies in the field of new integrated circuit materials, and move towards the highest end of the industrial chain and value chain.Full forceStep forward.
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